3C Electronics and semiconductors-Jichuan Chemical

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3C Electronics and semiconductors

Through the synergistic effect of "chemical corrosion" and "mechanical grinding", the global nanometer-scale flattening of the wafer surface was achieved, clearing the topographical obstacles for the precise stacking of multi-layer circuits. However, this process inevitably leaves particles, polishing fluid, and metal impurities on the chip surface. Therefore, efficient cleaning technology follows closely, becoming the key defense line to ensure the cleanliness of the chip.

The current cleaning process has evolved from the traditional batch-tank cleaning to various modes such as single-chip cleaning, ultrasonic cleaning, and intelligent dry cleaning. Especially in advanced manufacturing processes, cleaning not only needs to thoroughly remove the CMP residues but also must avoid damaging the delicate nanostructures. With the integration of artificial intelligence technology, the intelligent ratio adjustment and real-time monitoring control of the cleaning solution have become new technological trends, aiming to further improve cleaning efficiency and chip yield through data-driven optimization.