The abrasive is firmly embedded in the grinding pad to achieve high efficiency and stable removal rate, increasing the grinding efficiency by more than 2 times, shortening the CMP time by more than 20%, and the grinding rate can be more than twice that of the mortar grinding process with the same particle size.
2. Optimized abrasive layer shape to achieve higher surface quality after wafer processing, and to ensure excellent workpiece flatness control performance (TTV, Warp, Bow).
3. No need to mix the slurry, which saves time and improves the cleanliness of the workplace. There is no slurry treatment cost, and the environmental cleaning expenses are also saved.
4. Through the use of adhesive and the grinding disc for bonding, a convenient installation and disassembly process is achieved. The fixed grinding pad can be directly installed onto the existing machine board without requiring additional capital investment.